DEA – Dielectric cure analyser

Dielectric cure monitoring measures electrical properties to determine the cure state and viscosity of thermoset materials, at the same time providing insight into chemistry, reaction rate, formulation and physical parameters.

Dielectric cure monitoring is a convenient quantitative method that can be used in Research and Development, Quality Assurance/Quality Control, and manufacturing and polymer processing.

Processing environments:

• Ovens
• Presses/Autoclaves
• Pultruders and extruders
• Batch reaction vessels
• Materials
• Epoxy
• Polyurethane/Polyester/Polystyrene
• Composites and laminates
• Bulk/Sheet molding compound
• Paints and coatings
• Applications
• Formulation, reaction rate and cure studies
• Diffusion studies
• Cure and process development/monitoring
• Materials testing
• Statistical quality control